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ieee.org
Challenges and Impact of Surface Properties on Wafer-level Hybrid Bonding Process for Industrial Application
(23:14 Q&A) Dr. Vikas Dubey, senior scientist, Fraunhofer ENASPresented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.Summary: Wafer-level hybrid bonding is critical for achieving high-density 3D heterogeneous integration in advanced electronic packaging, meeting the industry’s rising ...
1 month ago
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