A technical paper titled “Characterizing semiconductor devices for all-electric aircraft” was published by researchers at University of Strathclyde (Glasgow) and Airbus UpNext. “Cryogenic propulsion ...

A lack of planarity along the interface between the solder and the ceramic raft in an IGBT module is a common anomaly that can make heat dissipation uneven across the die and cause the die to crack.

Dissipated heat in a junction is one of the major effects that can influence the reliability of die-attach materials used in an IGBT’s chip. Power cycling tests are ideal to mimic the lifecycle of a ...

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

The long-term reliability of power IGBT modules depends strongly on the structural integrity of the module. Since their introduction in the 1980s, IGBT modules have accelerated the transition from ...

Research and Markets has announced the addition of the "Infineonc: Teardown Analysis" report to their offering. The CooliR²Die innovative power module from Infineon is an IGBT module for automotive ...

Power Integrations has introduced single version of its dual-channel Scale-iFlex gate-drivers for IGBT modules up to 3.3kV – sized to fit 100 x 140mm ‘new dual’ IGBT modules. Applications are foreseen ...

Cissoid, the Belgian power semiconductor specialist, is introducing new families of power modules designed for automotive, industrial, and energy markets and covering a wide variety of current and ...