IEEE

A Reliable ESD 3D-Integrated Design and Simulation (3D-IDS) Methodology for Wafer on Wafer Stacked DRAM

Abstract: The Electro-Static Discharge (ESD) protection design and verification methodology are particularly important for the Wafer on Wafer (WoW) stacked system due to the miniaturization of ...
IEEE

Design and Implementation of a D-Band Guanella Transformer-Based Stacked Doherty Power Amplifier in 250-nm InP DHBT

Abstract: This article presents a Guanella transformer-based stacked Doherty power amplifier (PA) operating in D-band frequencies (110–170 GHz) in a 250-nm InP DHBT process. The Doherty PA is ...
Morningstar

Synopsys Supports New Arm AGI CPU with Full-Stack Design Solutions

Synopsys' broad portfolio of design, analysis, and verification solutions available on Arm-based architecture enables data center-class requirements and low total cost of compute during development ...
digitalcameraworld

This Sony stacked sensor uses an unusual design to help to save costs and boost performance

Sony has added a new sensor to its list of commercial photography semiconductors, featuring a new architecture that reduces production costs while boosting camera performance. The Sony IMX820 is a ...