The group has delivered a step change in profitability with impressive earnings growth in the first half of the financial year. The Transact platform demonstrated strong performance in flows and FUD, ...

Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

Forward-looking: For years, the chip industry has chased better performance by shrinking transistors and squeezing more of them onto a flat slice of silicon. That strategy is running into hard limits.

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

The need for more adaptable solutions and the U.S. Air Force’s new Autonomy Government Reference Architecture, or A-GRA, are ...