Semiconductor Engineering

Module Testing Adds New Challenges

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
EDN

Combine in-circuit and functional component test advantages

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...
Digi Times

New battlefield of vehicle functional safety: Efficient solutions for achieving ISO 26262 compliance in module-level products

With the ongoing evolution of automotive electrification and intelligence, functional safety has expanded from advanced ADAS platforms to every electronic control unit (ECU) and module component in ...
Semiconductor Engineering

Doing More At Functional Test

SE: Why is applying functional test content so challenging today? Ruiz: There are a couple of different factors that make successfully applying functional patterns on the tester a challenge. In fact, ...
EDN

Optical switches assist functional test

With the proliferation of fiber-optic products containing interfaces ranging from Gigabit Ethernet to 10-Gbps SONET, the demand for optical testing capabilities is high. Unfortunately, so is the cost ...