Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

There’s a problem with fuses. On the face of it, testing would seem to be a one-shot deal — exceed the rated current and see if it blows. But once you know the answer, the device is useless. If only ...

This whitepaper discusses the advantages of transient thermal test methods for IC package and thermal interface material (TIM) thermal characterization testing vs steady state methods. These methods ...

As a cautious analog-centric engineer, I have always liked traditional thermal-based fuses and been somewhat skeptical of electronic fuses (also written as e-fuses or eFuses) due to their active ...