As a seasoned tester, the responsibilities in defect management extend beyond the routine tasks of reporting issues and verifying resolutions. While these ...

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with content, and download exclusive resources. In this episode, Thomas Betts chats with ...

Physical defects like shorts and opens may occur during any step of the fabrication process. Well-known fault models like stuck-at (SA), 1 transition (TR), 2 N-detect (ND), 3 gate-exhaustive (GE), 4 ...