A new study explores deep learning for image-based defect detection during 3D printing, looking to catch bad builds.

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

Within the context of semiconductor inspection and failure analysis, latent defects present a significant challenge because they make it difficult to determine whether a fault originated during ...