Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...

TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...

A central development at the summit was the official formation of the Indian Design, Semiconductors, Packaging and Systems (IDSPS) division under IESA. This new entity, led by CEO Prof. Rao Tummala, ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Kaynes has also forged a significant partnership with global industrial software giant Siemens to enhance its system and package design capabilities, Panicker added. Under the collaboration, Kaynes ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...