By Milana Vinn and Amy-Jo Crowley NEW YORK/ LONDON, March 12 (Reuters) - BE Semiconductor Industries has been fielding takeover interest, as demand for its chip-packaging technology has become more ...
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Exclusive-Besi fields takeover interest on surging demand for advanced chip packaging, sources say
By Milana Vinn and Amy-Jo Crowley NEW YORK/LONDON, March 13 (Reuters) - BE Semiconductor Industries has attracted takeover interest as its chip-packaging technology becomes increasingly strategic for ...
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...
Fresh Inset’s packaging technology aims to reduce food waste, improve produce longevity on shelves
European tech company Fresh Inset introduces its Vidre+ Complex application in the US, which is designed to extend produce freshness, quality, appearance and nutrient value, without disrupting brands’ ...
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach ...
At the leading global packaging exhibition Interpack, the company will highlight its efficient, scalable, and sustainable ...
Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...
SK hynix has just announced it signed a memorandum of understanding with TSMC for collaboration to make next-generation HBM memory and enhance logic and HBM integration through advanced packaging ...
CINCINNATI--(BUSINESS WIRE)--ProAmpac, a leader in flexible packaging and material science, announces the launch of ProActive Intelligence Moisture Protect (MP-1000), a patent-pending breakthrough ...
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging sector. A ...
Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
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