AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields.
Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
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