EDN

Marvell unveils 64 Gbit/s D2D interface IP

Marvell Technology, Inc. has claimed the industry’s first 2-nm 64 Gbits/s bi-directional die-to-die (D2D) interconnect, offering higher bandwidth and efficiency together with advanced power management ...
Seeking Alpha

Marvell Unveils Industry's First 64 Gbps/wire Bi-Directional Die-to-Die Interface IP in 2nm to Power Next Generation XPUs

New D2D interface IP offers more than 3x bandwidth density of equivalent UCIe interface while requiring far less silicon Advanced power management capability automatically adapts to bursty data center ...
Business Wire

Avicena Announces Scalable Sub-pJ/bit LightBundle™ Chiplet Interconnect with 10m Reach

Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance, driven by applications like ChatGPT based on large language models (LLMs). This requires ...
Semiconductor Engineering

GUC GLink Test Chip Uses In-Chip Monitoring And Deep Data Analytics For High Bandwidth Die-To-Die Characterization

Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized ...
KTLA

GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring

HAIFA, Israel, Oct. 26, 2022 /PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced the results of its collaboration with advanced ASIC provider, ...
Design-Reuse

<4Gbps Low Power D2D Interface in TSMC 28nm

Custom die-to-die high-speed interface in 28nm process technology. The I/O cells are defined as TX only, and RX only, and have two modes of operation, ...
SpaceNews

The satellite industry cannot ignore the huge potential of D2D services

Concept art of various communications satellites around Earth. Credit: U.S. Government Archive / Public Domain If you have been following the news on Direct to Device (D2D) services lately, you will ...