3D printing and silicon photonics have combined in a rather exciting way this week. Researchers at MIT have engineered a novel 3D printing design on a single computer chip, officially the world's ...

New vertical device architecture promises stable, ultra-dense semiconductor stacking for future AI and high-performance ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Researchers used 3D printing and capillary action to create customizable neural chips, expanding design freedom for brain research, biosensors and biocomputing. (Nanowerk News) Cultured neural tissues ...

Researchers developed a dual-modulated vertically stacked transistor that eliminates current leakage at nanoscale channel lengths, advancing low-power 3D chip integration.

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

Life Sciences / Bio: ROCS X is an AI-enabled virtual screening solution that enables scientists to conduct 3D searches of over 200 trillion drug-like molecules. Target X is a physics-based AI solution ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...